TERAHERTZ COMMUNICATIONS AT 300 GHz: DEVICES, PACKAGES, AND SYSTEM

The talk was delivered by Prof. Ho-Jin Song of POSTECH, Korea. Prof Song highlighted the importance of Terahertz frequencies in terms of large bandwidth and high data capacity. Next, the speaker discussed the various techniques to achieve 100 Gbps data transmission at 220 GHz. The speaker explained that III-V semiconductor HEMT is mostly used in THz devices. The transceiver is beamforming type and packaging is wafer-level at THz. Moreover, Prof. Song informed about the first full system demonstration in 20 Gbps KIOSK system at 300 GHz during 2011-2015. Lastly, Prof Song concluded that the upcoming phase of THz communications would be about PHY and REED architecture. The potential applications of THz communications can be in high data rate WPAN/WLAN, backhaul/fronthaul links, wireless links in data centers, intra-device communications, and kiosk downloads.