Welcome to
IEEE ELECTRONICS PACKAGING SOCIETY SBC
SRI SAI RAM ENGINEERING COLLEGE
INTRODUCTION
Leading International Forum: The IEEE Electronics Packaging Society is the foremost global platform for scientists and engineers actively involved in research, design, and development of groundbreaking advancements in microsystems packaging and manufacturing.
Objectives: The society’s objectives are primarily scientific, literary, and educational in nature. It aims to:
- Advance the theory and practice of electrical and electronics engineering.
- Promote progress in allied arts and sciences related to electronics packaging.
- Maintain a high level of professional standing among its members and others within its field of interest.
Professional Standing: The IEEE Electronics Packaging Society places special emphasis on upholding a high level of professional standing among its members and in the broader community.
Cooperation and Information Exchange: The society actively fosters cooperation and the exchange of technical knowledge through:
Technical conferences and workshops: Organizing events where members and others can share research findings and insights.
Peer-Reviewed Publications: Publishing scientific articles and research papers to disseminate valuable knowledge within the field.
Collaboration with Other Organizations: Collaborating with external organizations to further the goals and objectives of the society.
Affiliation: The IEEE Electronics Packaging Society is one of the 38 technical Societies within the broader Institute of Electrical and Electronics Engineers (IEEE) organization.
VISION
A commitment to environmentally responsible electronic packaging,promoting sustainable materials, practices, and waste reduction initiatives by thrive on cross-disciplinary collaboration, bringing together experts from diverse fields to address complex challenges in electronic packaging field.
MISSION
To advance the science, technology, and practice of electronic packaging with innovation, and sustainability by providing a platform for interdisciplinary collaboration among professionals, researchers and organizations in the field of electronic packaging.