2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Dear Colleagues,

The organising committee of SIITME 2020 kindly invites you to submit an abstract/paper to the 2020 IEEE 26^th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will be held as a virtual, live conference, on October 21st–24th, 2020.
This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2020. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.