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2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)

October 21, 2020 - October 24, 2020

Dear Colleagues,

The organising committee of SIITME 2020 kindly invites you to submit an abstract/paper to the 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will be held as a virtual, live conference, on October 21st–24th, 2020.
This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2020. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.

Venue

Online

Organizer

SIITME committee
Phone:
Splaiul Independentei 313 06042, Bucharest, Romania
Email:
siitme@cetti.ro
Website:
http://siitme.ro