Abstract

The Modeling and Simulation Chapter of the Heterogeneous Integration Roadmap presents the clear need for modelling & simulation to support co-design across the die-package-board-system domains. At present electrical, thermal, and mechanical analysis is mainly undertaken separately with electrical and recently thermal analysis undertaken for chip-design, and electrical, thermal, and mechanical analysis undertaken at the package/board and system levels by different design teams, generally using different tools. The future is a more integrated and collaborative approach, using multi-physics and machine learning tools, to address issues such as signal/power integrity, thermal management, and reliability. This webinar will detail the current state-of-the-art, challenges (such as chip-package interactions), and potential solutions to these. Several examples will be demonstrated detailing progress in modelling, simulation and characterization methodologies for multi-physics and multi-scale analysis.

Presenter: Professor Chris Bailey and Professor Xuejun Fan