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2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

October 27, 2021 - October 31, 2021

Dear Colleagues,

The SIITME Steering Committee has, in agreement with IEEE and IEEE Hungary &Romania EPS&NTC Joint Chapter, decided to run SIITME 2021 as a virtual, live conference on the 27th – 30th October 2021.

This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2021. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.

Venue

Online

Organizer

SIITME committee
Phone:
Splaiul Independentei 313 06042, Bucharest, Romania
Email:
siitme@cetti.ro
Website:
http://siitme.ro